Committees > Technical Program
Technical Program Chairs |
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Fabrice CAIGNET |
LAAS-CNRS, University of Toulouse (France) |
Hélène FREMONT |
IMS, University of Bordeaux (France) |
Nathalie LABAT |
IMS, University of Bordeaux (France) |
François MARC |
IMS, University of Bordeaux (France) |
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Sub-committee Chairs |
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Topic A: Quality and Reliability assessment techniques and methods for Devices and Systems
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Enrique MIRANDA |
Universitat Autònoma de Barcelona (Spain) |
Cora SALM |
University of Twente (Netherlands) |
Ninoslav D. STOJADINOVIC |
University of Nis (Serbia) |
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Topic B: Semiconductor Failure Mechanisms & Reliability for Si technologies & Nanoelectronics
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Alain BRAVAIX |
IM2PN-CNRS, ISEN (France) |
Gabriella GHIDINI |
STMicroelectronics (Italy) |
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Topic C: Progress in Failure Analysis: Defect Detection and Analysis
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Ingrid DE WOLF |
IMEC (Belgium) |
Julien GOXE |
NXP (France) |
Giovanna MURA |
University of Cagliari (Italy) |
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Topic D: Reliability of Microwave devices and circuits
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Michael DAMMANN |
Fraunhofer IAF (Germany) |
Nathalie MALBERT |
IMS, University of Bordeaux (France) |
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Topic E: Packaging and Assembly Reliability and Failure Analysis
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Alexandrine GUÉDON-GRACIA |
IMS, University of Bordeaux (France) |
Julien PERRAUD |
THALES (France) |
Kirsten WEIDE-ZAAGE |
University of Hannover (Germany) |
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F : Power Devices and Electronic System : Reliability and Failure Analysis |
Topic F1: Smart-power devices, IGBT, Thyristors
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Mauro CIAPPA |
ETH Zurich (Switzerland) |
Evgueniy STEFANOV |
NXP (France) |
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Topic F2: SiC and GaN power devices
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Matteo MENEGHINI |
University of Padova (Italy) |
Frédéric MORANCHO |
LAAS-CNRS, University of Toulouse (France) |
Loic THEOLIER |
IMS, University of Bordeaux (France) |
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Topic F3: Power Electronic System reliability
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Olivier CREPEL |
AIRBUS (France) |
Francesco IANNUZZO |
University of Aalborg (Denmark) |
Wuhua LI |
University of Zhejiang (China) |
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Topic G: Photonics Reliability
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Massimo VANZI |
University of Cagliari (Italy) |
Alain BENSOUSSAN |
Thales Alénia Space – IRT Saint-Exupery(France) |
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Topic H: MEMS and sensors Reliability
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Stefan OBERHOFF |
Robert Bosch GmbH (Germany) |
Jérémie DHENNIN |
ELEMCA (France) |
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I : Extreme environments and Radiation |
Topic I1: ESD-EOS, Latchup
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Philippe GALY |
STMicroelectronics (France) |
Dionyz POGANY |
Vienna University of Technology (Austria) |
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Topic I2: EMC-EMI (integrated circuits, power electronic systems)
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Tristan DUBOIS |
IMS, University of Bordeaux (France) |
Christian MAROT |
AIRBUS (France) |
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Topic I3: Radiation impact on circuits and systems reliability
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Julien MEKKI |
CNES (France) |
Slawosz UZNANSKI |
CERN (Switzerland) |
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SS : Special Session "Space and Aeronautic systems" |
Michel LABRUNEE |
CNES (France) |
Philippe PONS |
Aerospace Valley (France) |
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