Scope of Papers

 Papers are requested on the following topics:

 

A - Quality and Reliability assessment techniques and methods for Devices and Systems

  • Design for reliability, Built-in reliability,
  • Virtual qualification, Reliability simulation,
  • Advanced models for Reliability prediction,
  • Reliability test structures, Limits to accelerated tests,
  • Screening methods, Yield/reliability relationship,
  • Obsolescence, Counterfeit.

B – Semiconductor Failure Mechanisms & Reliability for Si technologies & Nanoelectronics

  • Process-related issues, Passivation stability,
  • Hot carriers injection, NBTI, TDDB,
  • High-K dielectrics and gate stacks,
  • Low-K dielectrics and Cu interconnects,
  • Metal migration: mechanical and thermal aspects,
  • Non-volatile and programmable cells,
  • Silicon on Insulator devices,
  • Nano-electronics, Nano-electronic materials for solid state devices.

C – Progress in Failure Analysis: Defect Detection and Analysis

  • Electron, ion and optical beam techniques,
  • Scanning probe techniques,
  • Static or dynamic techniques, Backside techniques,
  • Acoustic microscopy,
  • Electric or magnetic field based techniques,
  • Electrical, thermal and thermo-mechanical characterization,
  • Sample preparation, construction analysis,
  • Failure analysis: case studies.

D – Reliability of Microwave devices and circuits

  • Wide band gap semiconductors,
  • Microwave and compound semiconductor devices.

E - Packaging and Assembly Reliability and Failure Analysis

  • Electrical Modeling & Simulations,
  • Mechanical Modeling & Simulations,
  • 3D / TSV, Flip chip, Advanced substrates,
  • Chip/package interaction.

F - Power Devices and Electronic System : Reliability and Failure Analysis

            F1 - Smart-power devices, IGBT, thyristors,

            F2 - SiC and GaN power devices

            F3 - Power Electronic System reliability

G – Photonics Reliability

  • Solar Cells and Display,
  • Optoelectronics,
  • Organic electronics: OLED, Electronic Ink, TFT

H – MEMS and sensors Reliability

  • Bio-electronics, Bio-sensors, Nano-Bio-technologies,
  • MEMS and MOEMS,
  • NEMS and nano-objects.

I - Extreme environments and Radiation

            I1 - ESD-EOS, Latchup

            I2 - EMC-EMI (integrated circuits, power electronic systems),

            I3 - Radiation impact on circuits and systems reliability.

 

SS : Special Session "Space and Aeronautic systems"

This session will be dedicated to clustering the specific papers submitted from this domain among the different topics (A to I).

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